Korean experts are not the first who reports information about Apple’s plans to release the slimmest smartphone in its history. The first steps in this direction was to abandon the standard 3.5 mm headphone Jack. The new iPhone 7 will be able to connect a headset through Lightning adapter. Now, after the refusal of audiogeek, Apple’s developers are ready to use the space under the body to the maximum. Technology for fan-out will reduce radio frequency and antenna modules, and to connect them in a common chip. This will lead to a significant reduction of body that will allow the iPhone 7 to be the thinnest smartphone company in Silicon valley. Presentation of the new gadget from Apple is traditionally scheduled for the fall of 2016. The company’s managers hope that the new smartphone will be sold much better iPhone SE, which showed poor results in dealer networks.